Better, Faster, Cheaper and Now Smaller?

  • October 06, 2018
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For last few decades, the practice of making devices smaller was left up to the giants of innovation like Intel and Apple. Often it took hundreds of millions or even billions of dollars and enormous resources to engineer products into smaller packages while adding functionality. However, as industries have evolved, innovations have allowed for smaller more agile teams of engineers and innovators to think about miniaturization from the beginning.

For Leardon Solutions, building small often comes at the request from two industries in particular and those industries are medical devices and consumer products. From an innovation standpoint, these two industries now have more in common than not. HUGE leaps in innovation are being made in offsite and bedside patient care by the introduction of devices with low power consumption and high-performance computing abilities plus technologies such as WiFi and Bluetooth communication specs.

Prototyping and testing small high-performance devices has never been more achievable than now. Microprocessor kits like Intel Edison, Rasberry Pi and Beaglebone Black offer unmatched power and size for the money.

The communities built up around these technologies have built robust libraries of codes and commands in an open source environment allowing for teams to test, validate, innovate and test again for a fraction of what it cost just five years ago.

While many custom applications require a bit more development, these baseline microprocessor kits can get a creative team far in their development efforts. Combined with other affordable technologies like 3D printing, getting to a proof-of-concept that can influence investment and interest is now a much shorter and less expensive journey than it has ever been.

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